Saint-Gobain
SAINT-GOBAIN TEKBOND (HANGZHOU) NEW MATERIALS CO., LTD.
CATEGORIAS
TEK5545
TEKBOND Hot melt adhesive is an adhesive that can melt and bond materials after heating. It usually exists in solid form, transforms into a liquid state after heating, and solidifies again after cooling, thereby achieving a bonding effect. Tekbond Hot melt adhesive is widely used in various industries such as packaging, woodworking, electronics, and automobiles, and is favored due to its strong bonding ability and rapid curing characteristics.
TEK5735
TEKBOND Hot melt adhesive is an adhesive that can melt and bond materials after heating. It usually exists in solid form, transforms into a liquid state after heating, and solidifies again after cooling, thereby achieving a bonding effect. Tekbond Hot melt adhesive is widely used in various industries such as packaging, woodworking, electronics, and automobiles, and is favored due to its strong bonding ability and rapid curing characteristics.
TEK5701
TEKBOND Hot melt adhesive is an adhesive that can melt and bond materials after heating. It usually exists in solid form, transforms into a liquid state after heating, and solidifies again after cooling, thereby achieving a bonding effect. Tekbond Hot melt adhesive is widely used in various industries such as packaging, woodworking, electronics, and automobiles, and is favored due to its strong bonding ability and rapid curing characteristics.
TEK5778
TEKBOND Hot melt adhesive is an adhesive that can melt and bond materials after heating. It usually exists in solid form, transforms into a liquid state after heating, and solidifies again after cooling, thereby achieving a bonding effect. Tekbond Hot melt adhesive is widely used in various industries such as packaging, woodworking, electronics, and automobiles, and is favored due to its strong bonding ability and rapid curing characteristics.
TEK5768
TEKBOND Hot melt adhesive is an adhesive that can melt and bond materials after heating. It usually exists in solid form, transforms into a liquid state after heating, and solidifies again after cooling, thereby achieving a bonding effect. Tekbond Hot melt adhesive is widely used in various industries such as packaging, woodworking, electronics, and automobiles, and is favored due to its strong bonding ability and rapid curing characteristics.
TEK5783
TEKBOND Hot melt adhesive is an adhesive that can melt and bond materials after heating. It usually exists in solid form, transforms into a liquid state after heating, and solidifies again after cooling, thereby achieving a bonding effect. Tekbond Hot melt adhesive is widely used in various industries such as packaging, woodworking, electronics, and automobiles, and is favored due to its strong bonding ability and rapid curing characteristics.
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