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TEK5783
TEKBOND Hot melt adhesive is an adhesive that can melt and bond materials after heating. It usually exists in solid form, transforms into a liquid state after heating, and solidifies again after cooling, thereby achieving a bonding effect. Tekbond Hot melt adhesive is widely used in various industries such as packaging, woodworking, electronics, and automobiles, and is favored due to its strong bonding ability and rapid curing characteristics.
Typical Colors
Off white particles
Package
25kg
Applications
- Particle board, solid wood, medium fiber board and decoration
Typical Data
- Viscosity (mPa-s): 156000
Softening point (°C): 80~120
Tensile strength (Mpa): 3
Process Temperature: 180-210°C
Data Download:
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Contact
ContactAddress
Saint-Gobain Adhesives & Sealants APAC Headquarter: No. 11-3, Hongtai Si Lu 311200 Hangzhou • ChinaSocial Media
Copyright 2007 @ SAINT-GOBAIN JOINLEADER (HANGZHOU) NEW MATERIALS CO., LTD. All rights reserved
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