Saint-Gobain
SAINT-GOBAIN TEKBOND (HANGZHOU) NEW MATERIALS CO., LTD.
CATEGORIES
TEK5768
TEKBOND Hot melt adhesive is an adhesive that can melt and bond materials after heating. It usually exists in solid form, transforms into a liquid state after heating, and solidifies again after cooling, thereby achieving a bonding effect. Tekbond Hot melt adhesive is widely used in various industries such as packaging, woodworking, electronics, and automobiles, and is favored due to its strong bonding ability and rapid curing characteristics.
Typical Colors
Yellow transparent particles
Package
25kg
Applications
  • Edge. Especially suitable for high-speed fully automatic edge banding machines and oblique edge banding machines. “
Typical Data
  • Viscosity (mPa-s): 142000
    Softening point (°C): 95~110
    Tensile strength (Mpa): 5
    Process Temperature: 150-180°C
Data Download:
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Saint-Gobain Adhesives & Sealants APAC Headquarter: No. 11-3, Hongtai Si Lu 311200 Hangzhou • China

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