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TEK5545
TEKBOND Hot melt adhesive is an adhesive that can melt and bond materials after heating. It usually exists in solid form, transforms into a liquid state after heating, and solidifies again after cooling, thereby achieving a bonding effect. Tekbond Hot melt adhesive is widely used in various industries such as packaging, woodworking, electronics, and automobiles, and is favored due to its strong bonding ability and rapid curing characteristics.
Typical Colors
Transparent slightly yellow block
Package
2kg 190kg
Applications
- Used for flat pasting technology, suitable for bonding PVC, PET and other substrates such as particleboard, density board, and triamine board.
Typical Data
- Viscosity (mPa-s): 15250
Softening point (°C): 98
Tensile strength (Mpa): 3
Process Temperature: 130-170 ℃
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Saint-Gobain Adhesives & Sealants APAC Headquarter: No. 11-3, Hongtai Si Lu 311200 Hangzhou • ChinaSocial Media
Copyright 2007 @ SAINT-GOBAIN JOINLEADER (HANGZHOU) NEW MATERIALS CO., LTD. All rights reserved
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