Saint-Gobain
SAINT-GOBAIN TEKBOND (HANGZHOU) NEW MATERIALS CO., LTD.
CATEGORIES
TEK5701
TEKBOND Hot melt adhesive is an adhesive that can melt and bond materials after heating. It usually exists in solid form, transforms into a liquid state after heating, and solidifies again after cooling, thereby achieving a bonding effect. Tekbond Hot melt adhesive is widely used in various industries such as packaging, woodworking, electronics, and automobiles, and is favored due to its strong bonding ability and rapid curing characteristics.
Typical Colors
Beige semi transparent particles
Package
25kg
Applications
  • Mainly used for edge banding of PVC, acrylic, ABS, melamine and other materials, as well as for bonding with fiberboard, particle board, etc
Typical Data
  • Viscosity (mPa-s): 160000
    Softening point (°C): 125~135
    Tensile strength (Mpa): 3.6
    Process Temperature: 170-190°C
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Saint-Gobain Adhesives & Sealants APAC Headquarter: No. 11-3, Hongtai Si Lu 311200 Hangzhou • China

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