Saint-Gobain
TEKBOND APAC
CATEGORIES
TEK7140
Tekbond Tech SMP is an industrial grade product series. They have high strength and fast cure ability. They are silane-modified polyether adhesive used for flexible bonding and sealing. They have the function of absorbing andcompensating dynamic load. They are suitable for bonding of various materials,such as metal, glass, plastic, etc. They are widely used in engineering machinery, agricultural machinery, machine tools, elevator assembly and other fields.
Typical Colors
White
Package
300ml
Applications
  • Bonding & Sealing, used for installation of various windscreens/windshield, metal to metal/metal to glass
Typical Data
  • Tack free time (min): 10
    Density (g/cm³): 1.39
    Curing depth (mm/24h): 3.5
    Hardness(shoreA/7d): 55
    Dumbbell plate maximum tensile strength (Mpa): 4.5
    Dumbbell plate elongation (%): 700
Data Download:
Download Center

Contact

Contact

Address

Saint-Gobain Adhesives & Sealants APAC Headquarter: No. 11-3, Hongtai Si Lu 311200 Hangzhou • China

Social Media

E-mail

joinleader.sg@saint-gobain.com
Copyright 2007 @ SAINT-GOBAIN JOINLEADER (HANGZHOU) NEW MATERIALS CO., LTD. All rights reserved
      
TOP